Etching, Machining and Bonding

Deep Reactive Ion Etch (Silicon):

Silicon DRIE using the Bosch process. Our STS DRIE has pulsed platen bias to minimize “footing” at oxide etch stops.

Anisotropic Silicon Wet Etching:

Extensive experience with KOH, TMAH and EDP wet etchants.

MicroMilling:

Dover Instruments Ultra-High-Precision Micro Milling Machine is a CNC milling station with nanometer spatial resolution for machining virtually any solid material (i.e., metals, polymers, ceramics, etc.)

Wafer Level Bonding:

Suss MicroTec SB6 for Si/glass anodic bonding, glass/glass thermal compression bonding and Si/Si fusion bonding.

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The center is housed within two campus cleanrooms, including a 9,000-sq.-ft., seven-bay, Class 100/1000 facility designed by nationally renowned AGI consultants.
Our wide variety of micro/nanoprocessing tools and 10-plus years of operating experience make our state-of-the-art facilities popular not only with researchers at UofL and other universities throughout the Ohio Valley region, but with industry and government laboratories nationwide, too.