Etching, Machining and Bonding
Plasma Etching:
RIE systems are capable of providing selective silicon, SiO2 and Si3N4 etches as well as ashing processes.Xenon Di-Fluoride Etching:
Dry anisotropic silicon etching using the Xactix XeF2 etching system allows for efficient etching of silicon microstructures prone to stiction.Miscellaneous:
Nano-imprinting, micromolding, chemical mechanical polishing, ultrasonic drilling, etc.page 1 - page 2
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