Packaging

Dicing:

Automated Disco Dicing Saw for silicon, glass and alternative substrate dicing.

Wire Bonding:

K&S wedge, ball and deep access bonders for aluminum and gold 1-mil wire bonding.

Flip Chip Packaging:

Finetech Fineplacer “pico” system for die placement up to 5μm. Can handle SMCs up to 17-mm side length.

Printed Circuit Boards:

An automated milling system for custom PCB production.

Lapping and Polishing:

Lapmaster system is capable of thinning a variety of substrates as well as final polishing.

Return to Products and Services Page

The center is housed within two campus cleanrooms, including a 9,000-sq.-ft., seven-bay, Class 100/1000 facility designed by nationally renowned AGI consultants.
Our wide variety of micro/nanoprocessing tools and 10-plus years of operating experience make our state-of-the-art facilities popular not only with researchers at UofL and other universities throughout the Ohio Valley region, but with industry and government laboratories nationwide, too.