Thermal Processing

Oxidation and Diffusion:

Thermal processes include wet and dry oxidation and boron and phosphorous diffusion.

Rapid Thermal Processes (RTP):

For silicon-based gate oxide growth and rapid thermal annealing.

PECVD:

For depositing nitrides and oxides.

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The center is housed within two campus cleanrooms, including a 9,000-sq.-ft., seven-bay, Class 100/1000 facility designed by nationally renowned AGI consultants.
Our wide variety of micro/nanoprocessing tools and 10-plus years of operating experience make our state-of-the-art facilities popular not only with researchers at UofL and other universities throughout the Ohio Valley region, but with industry and government laboratories nationwide, too.